FPC connectors are commonly used in the production of electronic products, primarily for various PCB boards in electronic devices. They typically feature a rectangular shape and are manufactured using stamping and injection molding processes, with explosion-proof characteristics. Phosphor bronze is often used as the contact material for FPC connectors, while plastic insulating materials are usually PA66. Commonly used FPC connector pitches include 0.5, 1.0, and 1.25.

During the production process, for small-pitch FPCs, it is necessary to package the coplanarity of terminals and the positional accuracy of terminal arrangement to minimize potential quality issues with connector products during packaging and transportation. FPC connectors typically employ two packaging methods: PVC tube encapsulation and carrier tape encapsulation.

The protection performance of the PVC small-pitch pipe-encapsulated FPC connector is inadequate, requiring manual PCB placement during the T process, which adds off-line procedures in customer assembly and significantly impacts production efficiency.

The packaging method for surface electronic components such as ICs, which utilizes tape-and-reel packaging, is designed based on the product's shape to effectively protect the components from damage. The T process allows for automated surface mount soldering, similar to other electronic components, eliminating the need for additional processes or equipment, thereby improving the production efficiency of PCB assembly.